IC & Sensor Packaging Expo Japan — Osaka
Osaka, Japan · May 12–14, 2027
Logo eklenmedi
- Sector
- Technology & Electronics
- Dates
- May 12–14, 2027
- Location
- Osaka, Japan
- Continent
- Asia
About the fair
IC & Sensor Packaging Expo Japan — Osaka is a trade fair in the Technology & Electronics sector, taking place in Osaka, Japan on May 12–14, 2027. You can apply as an exhibitor or visitor on Fuar Radar.
I want to take part in this fair
Fill in the form and our team will review your application and get in touch.
Frequently asked questions
When is IC & Sensor Packaging Expo Japan — Osaka taking place?
IC & Sensor Packaging Expo Japan — Osaka takes place on May 12–14, 2027.
Where is IC & Sensor Packaging Expo Japan — Osaka taking place?
In Osaka, Japan.
Which sector does IC & Sensor Packaging Expo Japan — Osaka belong to?
IC & Sensor Packaging Expo Japan — Osaka belongs to the Technology & Electronics sector.
Similar fairs
- Technology & ElectronicsElectrotest Japan — Osaka12-14 May 2027Osaka, Japan
- Technology & ElectronicsFine Process Technology Expo Japan — Osaka112-14 May 2027Osaka, Japan
- Technology & ElectronicsHighly-Functional Material Week — Osaka12-14 May 2027Osaka, Japan
- Technology & ElectronicsNepcon Japan — Osaka12-14 May 2027Osaka, Japan
- Technology & ElectronicsPhotonix Osaka12-14 May 2027Osaka, Japan
- Technology & ElectronicsNextech Week Tokyo21-23 Apr 2027Tokyo, Japan